Japan's Rapidus, UK Semiconductor Centre sign MOU on chip technology partnership
( June 16, 2026, 00:15 GMT | Official Statement) -- MLex Summary: Japan’s chipmaker Rapidus said on Monday that it has signed a memorandum of understanding with the UK Semiconductor Centre to support cooperation on semiconductor technology and manufacturing for next-generation AI applications. The agreement builds on Japan-UK efforts to deepen technology ties as Rapidus advances plans for mass production of 2-nanometer logic semiconductors in 2027.Statement follows:...
Prepare for tomorrow’s regulatory change, today
MLex identifies risk to business wherever it emerges, with specialist reporters across the globe providing exclusive news and deep-dive analysis on the proposals, probes, enforcement actions and rulings that matter to your organization and clients, now and in the longer term.
Know what others in the room don’t, with features including:
- Daily newsletters for Antitrust, M&A, Trade, Data Privacy & Security, Technology, AI and more
- Custom alerts on specific filters including geographies, industries, topics and companies to suit your practice needs
- Predictive analysis from expert journalists across North America, the UK and Europe, Latin America and Asia-Pacific
- Curated case files bringing together news, analysis and source documents in a single timeline
Experience MLex today with a 14-day free trial.